Silverdale Asia Bond Fund

2549006T6EVSAN1NMO03

The entity

Status: Active
LEI status: Lapsed - not renewed
Category: Fund
Legal form: 8888
Jurisdiction: Singapore
Entity created: February 1, 2021

Address

Country: Singapore
Legal address: 8 Temasek Boulevard, #35-02, Suntec Tower 3038988 SingaporeSingapore

Identifier

LEI: 2549006T6EVSAN1NMO03
Registered: November 5, 2020 at 06:00 PM UTC
Last updated: November 6, 2022 at 02:33 PM UTC
Next renewal: November 5, 2022 at 06:00 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Monetary Authority of Singapore (RA000524)
Identifier: T20VC0123D-SF005
Verified against: Monetary Authority of Singapore (RA000524)
Verified as: T20VC0123D-SF005
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Owned by

Silverdale Asia Bond Fund
Fund managerSingapore2549006T6EVSAN1NMO03

Owns1

Silverdale Asia Bond Fund
Fund under managementSingapore

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

Machine access

REST: https://lei.online/v1/entities/2549006T6EVSAN1NMO03This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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