UMC Benefit Board, Inc.

NW1K0TWN0GS1CWRVJY85

The entity

Country: United States
Legal address: C/O C T Corporation System, 208 South LaSalle Street, Suite 81460604 ChicagoUnited States (US-IL)
Head office: 1901 Chesnut Avenue60025 GlenviewUnited States (US-IL)

LEI: NW1K0TWN0GS1CWRVJY85
Registered: November 14, 2012 at 05:26 PM UTC
Last updated: August 4, 2023 at 03:18 PM UTC
Next renewal: December 30, 2014 at 06:57 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Services (Office of the Secretary of State) (RA000608)
Identifier: 66264416
Verified against: Business Services (Office of the Secretary of State) (RA000608)
Verified as: 66264416
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

REST: https://lei.online/v1/entities/NW1K0TWN0GS1CWRVJY85This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.