AP BONDING SOLUTIONS PRIVATE LIMITED

98450080763C6D9D7F03

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (YSP9)
Jurisdiction: India
Entity created: July 19, 2018

Address

Country: India
Legal address: OFF NO.18, 1ST FLOOR, HIGHWAY TOWERS, MUMBAI PUNE RD, CHINCHWAD411019 PUNEIndia (IN-MH)

Identifier

LEI: 98450080763C6D9D7F03
Registered: January 7, 2022 at 11:54 AM UTC
Last updated: November 8, 2025 at 12:33 PM UTC
Next renewal: January 7, 2027 at 11:54 AM UTC
Issuer: Ubisecure RapidLEI (529900T8BM49AURSDO55)
Registered with: Companies Register (RA000394)
Identifier: U24304PN2018PTC177793
Verified against: Companies Register (RA000394)
Verified as: U24304PN2018PTC177793
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/98450080763C6D9D7F03This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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