Reap Technologies Limited

894500Q7JHDG3114LO21

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: 擔保有限公司 (S2E3)
Jurisdiction: Hong Kong SAR China
Entity created: June 26, 2018

Address

Country: Hong Kong SAR China
Legal address: 28/F, 1063 King's Road, Quarry Bay999077 Hong Kong IslandHong Kong SAR China

Identifier

LEI: 894500Q7JHDG3114LO21
Registered: May 16, 2023 at 02:27 PM UTC
Last updated: July 22, 2026 at 12:24 PM UTC
Next renewal: July 22, 2027 at 12:24 PM UTC
Issuer: EQS (529900F6BNUR3RJ2WH29)
Registered with: Companies Registry (RA000388)
Identifier: 69558597
Verified against: Companies Registry (RA000388)
Verified as: 69558597
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent has no LEI

Machine access

REST: https://lei.online/v1/entities/894500Q7JHDG3114LO21This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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