HK TONGBO TECHNOLOGY LIMITED

87550066JDDZF41K7T23

The entity

Status: Active
LEI status: Lapsed - not renewed
Category: Company
Legal form: 私人股份有限公司 (254M)
Jurisdiction: Hong Kong SAR China
Entity created: March 14, 2023

Address

Country: Hong Kong SAR China
Legal address: RM 9, 17/F CHINA MERCHANTS TOWER SHUN TAK CTR, NO 200 CONNAUGHT RD CENTRALHong KongHong Kong SAR China

Identifier

LEI: 87550066JDDZF41K7T23
Registered: June 3, 2025 at 06:46 AM UTC
Last updated: June 4, 2026 at 04:18 PM UTC
Next renewal: June 4, 2026 at 07:57 AM UTC
Issuer: GS1 (52990034RLKT0WSOAM90)
Registered with: Companies Registry (RA000388)
Identifier: 74987004
Verified against: Companies Registry (RA000388)
Verified as: 74987004
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/87550066JDDZF41K7T23This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

Start a new search