上海邦屏半导体有限公司

836800T8SVMVRO9JBK70

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China
Entity created
August 10, 2022

Address

Country
China
Legal address
城桥镇秀山路8号(上海市崇明工业园区)200001 黄浦区China (CN-SH)
Head office
芳甸路333弄20号801室200120 黄浦区China (CN-SH)

Identifier

LEI
836800T8SVMVRO9JBK70
Registered
Last updated
Next renewal
Identifier
91310230MABWR2HN5T
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91310230MABWR2HN5T
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
The parent is one or more private individuals

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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