Woodcomp Modules Oy

743700Y0ODTE2MOSAW64

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Osakeyhtiö (DKUW)
Jurisdiction: Finland
Entity created: September 28, 2011

Address

Country: Finland
Legal address: Länsiväylä 3, 92180 LAPALUOTOFI-92180 LAPALUOTOFinland

Identifier

LEI: 743700Y0ODTE2MOSAW64
Registered: June 1, 2023 at 09:00 PM UTC
Last updated: June 2, 2026 at 12:00 PM UTC
Next renewal: June 2, 2027 at 09:00 AM UTC
Issuer: Finnish Patent and Registration Office (PRH) (743700OO8O2N3TQKJC81)
Registered with: The Business Information System (BIS) (RA000188)
Identifier: 2431853-1
Verified against: The Business Information System (BIS) (RA000188)
Verified as: 2431853-1
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Owned by

Woodcomp Oy
Direct parent · Ultimate parentFinland743700KN3I31E31GY376

Machine access

REST: https://lei.online/v1/entities/743700Y0ODTE2MOSAW64This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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