EHMP-Engineering Oy

743700GPT2Y4F82ISM63

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Osakeyhtiö (DKUW)
Jurisdiction: Finland
Entity created: June 19, 1995

Address

Country: Finland
Legal address: Vaahteranmäentie, 04150 MARTINKYLÄFI-04150 MARTINKYLÄFinland

Identifier

LEI: 743700GPT2Y4F82ISM63
Registered: August 8, 2024 at 09:00 PM UTC
Last updated: August 9, 2026 at 12:00 PM UTC
Next renewal: August 9, 2027 at 09:00 AM UTC
Issuer: Finnish Patent and Registration Office (PRH) (743700OO8O2N3TQKJC81)
Registered with: The Business Information System (BIS) (RA000188)
Identifier: 1010648-2
Verified against: The Business Information System (BIS) (RA000188)
Verified as: 1010648-2
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/743700GPT2Y4F82ISM63This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

Start a new search