SponComp 2 Oy

7437006WZ8WSRBJCD688

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Osakeyhtiö (DKUW)
Jurisdiction: Finland
Entity created: November 16, 2022

Address

Country: Finland
Legal address: Viinikankaari 8 B, 01530 VANTAAFI-01530 VANTAAFinland

Identifier

LEI: 7437006WZ8WSRBJCD688
Registered: February 6, 2024 at 10:00 PM UTC
Last updated: February 7, 2026 at 01:00 PM UTC
Next renewal: February 7, 2027 at 10:00 AM UTC
Issuer: Finnish Patent and Registration Office (PRH) (743700OO8O2N3TQKJC81)
Registered with: The Business Information System (BIS) (RA000188)
Identifier: 3325677-4
Verified against: The Business Information System (BIS) (RA000188)
Verified as: 3325677-4
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No owner is known to control it

Machine access

REST: https://lei.online/v1/entities/7437006WZ8WSRBJCD688This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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