北京邦克佳软信息技术有限责任公司

6556005MY9APL4CEUJ80

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China
Entity created
March 7, 2014

Address

Country
China
Legal address
北京市朝阳区新房路3号院6号楼14层1705100000 朝阳区China (CN-BJ)

Identifier

LEI
6556005MY9APL4CEUJ80
Registered
Last updated
Next renewal
Identifier
9111010809517888XT
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
9111010809517888XT
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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