DIARCH BUILDCON PRIVATE LIMITED

6488Z18YC5Z033R0TE29

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (YSP9)
Jurisdiction: India
Entity created: August 14, 2019

Address

Country: India
Legal address: H/O-AMIT KUMAR, H.NO. -03, MADHYESHWAR SINGH PANCH-BHUSAULA DANAPUR, PHUWARISHARIF, Bihar801105 PatnaIndia

Identifier

LEI: 6488Z18YC5Z033R0TE29
Registered: May 22, 2026 at 08:50 AM UTC
Last updated: May 22, 2026 at 10:50 AM UTC
Next renewal: May 21, 2027 at 10:00 PM UTC
Issuer: Nasdaq LEI (485100001PLJJ09NZT59)
Registered with: Companies Register (RA000394)
Identifier: U45209BR2019PTC042989
Verified against: Companies Register (RA000394)
Verified as: U45209BR2019PTC042989
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/6488Z18YC5Z033R0TE29This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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