COMCON INTERNATIONAL POLYPACKS PRIVATE LIMITED

6488YCWVAH15W5767883

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (YSP9)
Jurisdiction: India
Entity created: July 4, 2024

Address

Country: India
Legal address: 83/162, DIAMOND HARBOUR ROAD, NATH PARA, 24 PGS(S), Paschim Barisha, West Bengal700063 KolkataIndia

Identifier

LEI: 6488YCWVAH15W5767883
Registered: March 10, 2025 at 07:01 AM UTC
Last updated: January 12, 2026 at 07:02 AM UTC
Next renewal: March 9, 2027 at 11:00 PM UTC
Issuer: Nasdaq LEI (485100001PLJJ09NZT59)
Registered with: Companies Register (RA000394)
Identifier: U22203WB2024PTC271909
Verified against: Companies Register (RA000394)
Verified as: U22203WB2024PTC271909
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/6488YCWVAH15W5767883This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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