PALIKA INFRATECH LLP

6488T4WSQ6K6E266A976

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Liability Partnership (U5S6)
Jurisdiction: India
Entity created: October 20, 2016

Address

Country: India
Legal address: BLOCK Q, MONDEAL BUSINESS PARK-2, NR. GURUDWARA S.G. HIGHWAY, BODAKDEV, Gujarat380054 AhmedabadIndia

Identifier

LEI: 6488T4WSQ6K6E266A976
Registered: December 17, 2025 at 09:32 AM UTC
Last updated: December 17, 2025 at 11:33 AM UTC
Next renewal: December 16, 2026 at 11:00 PM UTC
Issuer: Nasdaq LEI (485100001PLJJ09NZT59)
Registered with: Companies Register (RA000394)
Identifier: AAH-6468
Verified against: Companies Register (RA000394)
Verified as: AAH-6468
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/6488T4WSQ6K6E266A976This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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