AGARWAL & BHONDVE BUILDCON LLP

6488LP6T7UI296M89W52

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Liability Partnership (U5S6)
Jurisdiction: India
Entity created: December 9, 2019

Address

Country: India
Legal address: Sr/179/1, Ganesh Nagar, MIDC Road, Ravet Dehu Road, Maharashtra412101 PuneIndia

Identifier

LEI: 6488LP6T7UI296M89W52
Registered: January 21, 2026 at 09:06 AM UTC
Last updated: January 21, 2026 at 11:06 AM UTC
Next renewal: January 20, 2027 at 11:00 PM UTC
Issuer: Nasdaq LEI (485100001PLJJ09NZT59)
Registered with: Companies Register (RA000394)
Identifier: AAR-2513
Verified against: Companies Register (RA000394)
Verified as: AAR-2513
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/6488LP6T7UI296M89W52This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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