OS BUILDCON LLP

6488E7W0Y6RSJ725N737

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Liability Partnership (U5S6)
Jurisdiction: India
Entity created: January 9, 2025

Address

Country: India
Legal address: D NO. 3/356/2, GUNDALA REDDY STREET, Satyavedu, Andhra Pradesh517588 ChittoorIndia

Identifier

LEI: 6488E7W0Y6RSJ725N737
Registered: June 25, 2026 at 11:52 AM UTC
Last updated: June 25, 2026 at 01:55 PM UTC
Next renewal: June 24, 2027 at 10:00 PM UTC
Issuer: Nasdaq LEI (485100001PLJJ09NZT59)
Registered with: Companies Register (RA000394)
Identifier: ACL-2513
Verified against: Companies Register (RA000394)
Verified as: ACL-2513
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/6488E7W0Y6RSJ725N737This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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