RYAN-MOULDER INNOVATIONS LTD

64882UB01I6QH881DX02

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (H0PO)
Jurisdiction: United Kingdom
Entity created: September 12, 2024

Address

Country: United Kingdom
Legal address: 28 Wrentham AvenueNW10 3HA LondonUnited Kingdom

Identifier

LEI: 64882UB01I6QH881DX02
Registered: July 9, 2026 at 03:22 AM UTC
Last updated: July 9, 2026 at 05:22 AM UTC
Next renewal: July 8, 2027 at 10:00 PM UTC
Issuer: Nasdaq LEI (485100001PLJJ09NZT59)
Registered with: Companies Register (RA000585)
Identifier: 15953566
Verified against: Companies Register (RA000585)
Verified as: 15953566
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/64882UB01I6QH881DX02This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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