WOODSPIRE REALCOM LLP

648802A3QORQF9P86257

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Liability Partnership (U5S6)
Jurisdiction: India
Entity created: May 20, 2025

Address

Country: India
Legal address: COL-O-0802, 8th Floor, Emaar Colonnade, Sec 66, South City, Haryana122018 GurgaonIndia

Identifier

LEI: 648802A3QORQF9P86257
Registered: February 9, 2026 at 11:15 AM UTC
Last updated: February 9, 2026 at 01:15 PM UTC
Next renewal: February 8, 2027 at 11:00 PM UTC
Issuer: Nasdaq LEI (485100001PLJJ09NZT59)
Registered with: Companies Register (RA000394)
Identifier: ACO-5163
Verified against: Companies Register (RA000394)
Verified as: ACO-5163
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/648802A3QORQF9P86257This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

Start a new search