ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.

549300ZFFY4BYGZ1AX14

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (XEOV)
Jurisdiction: Malaysia
Entity created: October 29, 2021

Address

Country: Malaysia
Legal address: LEVEL 13, MENARA 1 SENTRUM 201, JALAN TUN SAMBANTHAN, BRICKFIELDS50470 KUALA LUMPURMalaysia (MY-14)

Identifier

LEI: 549300ZFFY4BYGZ1AX14
Registered: November 1, 2021 at 08:04 PM UTC
Last updated: September 1, 2025 at 12:28 PM UTC
Next renewal: October 27, 2026 at 12:00 AM UTC
Issuer: London Stock Exchange (213800WAVVOPS85N2205)
Registered with: Corporate Registry (RA000439)
Identifier: 202001040513 (1396834-X)
Verified against: Corporate Registry (RA000439)
Verified as: 202001040513 (1396834-X)
Corroboration: Partly confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Owned by

ASSEMBLY PAYMENTS PTE. LTD.
Direct parentSingapore5493008W0KUEW1VX6696
STANDARD CHARTERED PLC
Ultimate parentUnited KingdomU4LOSYZ7YG4W3S5F2G91

Machine access

REST: https://lei.online/v1/entities/549300ZFFY4BYGZ1AX14This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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