QUALCOMM ASIA PACIFIC PTE. LTD.

549300WXCP1TMLMJY351

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Company Limited by Shares (IWZF)
Jurisdiction: Singapore
Entity created: August 29, 2007

Address

Country: Singapore
Legal address: 9 RAFFLES PLACE, #26-01, REPUBLIC PLAZA048619 SINGAPORESingapore
Head office: 5775 Morehouse Drive92121 San DiegoUnited States (US-CA)

Identifier

LEI: 549300WXCP1TMLMJY351
Registered: June 26, 2018 at 02:30 PM UTC
Last updated: March 6, 2026 at 10:33 AM UTC
Next renewal: December 20, 2026 at 12:00 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Registry (RA000523)
Identifier: 200715933E
Verified against: Business Registry (RA000523)
Verified as: 200715933E
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Owned by

QUALCOMM GLOBAL TRADING PTE. LTD.
Direct parentSingapore0T70LJOI7CV4KICEYN65
QUALCOMM INCORPORATED
Ultimate parentUnited StatesH1J8DDZKZP6H7RWC0H53

Machine access

REST: https://lei.online/v1/entities/549300WXCP1TMLMJY351This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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