方圓資本(香港)有限公司

549300NDU4UYB3OZLG22

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: 私人股份有限公司 (254M)
Jurisdiction: Hong Kong SAR China
Entity created: July 28, 2017

Address

Country: Hong Kong SAR China
Legal address: Suite 504 Bank of America Tower, 12 Harcourt Road Central999077 Hong KongHong Kong SAR China

Identifier

LEI: 549300NDU4UYB3OZLG22
Registered: January 23, 2019 at 03:33 PM UTC
Last updated: October 16, 2025 at 11:56 AM UTC
Next renewal: October 25, 2026 at 10:43 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: 香港稅務局轄下的商業登記署 (RA000389)
Identifier: 68014516
Verified against: 香港稅務局轄下的商業登記署 (RA000389)
Verified as: 68014516
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

Machine access

REST: https://lei.online/v1/entities/549300NDU4UYB3OZLG22This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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