CLP Global Bond Fund

549300DMFSTO2S16YP30

The entity

Status: Active
LEI status: Issued and current
Category: Fund
Legal form: 8888
Jurisdiction: Hong Kong SAR China
Entity created: June 25, 2003

Address

Country: Hong Kong SAR China
Legal address: 18th Floor, Cosco Tower, 183 Queen's Road Central999077 Hong KongHong Kong SAR China
Head office: C/O AllianceBernstein Hong Kong Limited, 39th Floor, One Island East, Taikoo Place, 18 Westlands Road, Quarry Bay , Central and Western District999077 Hong KongHong Kong SAR China

Identifier

LEI: 549300DMFSTO2S16YP30
Registered: October 31, 2015 at 02:02 AM UTC
Last updated: August 19, 2026 at 07:07 PM UTC
Next renewal: September 9, 2027 at 06:48 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: No Registration Authority available (RA999999)
Verified against: No Registration Authority available (RA999999)
Corroboration: Supplied by the entity, not independently confirmed
GLEIF conformity: Meets the standard

Corporate structure

Owned by

聯博香港有限公司
Fund managerHong Kong SAR China549300GNB8SC2JEHDW74

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

Machine access

REST: https://lei.online/v1/entities/549300DMFSTO2S16YP30This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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