HFM Packaging, Ltd.

549300C7ONL0PXZY6Y15

The entity

Country: United States
Legal address: C/O Paul H Martinez, N26 W23322 Paul Road53072 PewaukeeUnited States (US-WI)
Head office: N26 W23322 Paul Road53072 PewaukeeUnited States (US-WI)

LEI: 549300C7ONL0PXZY6Y15
Registered: February 28, 2015 at 01:38 AM UTC
Last updated: August 4, 2023 at 04:16 PM UTC
Next renewal: February 26, 2016 at 02:17 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Corporation Section (Division of Corporate & Consumer Services, Department of Financial Institutions) (RA000642)
Identifier: H023449
Verified against: Corporation Section (Division of Corporate & Consumer Services, Department of Financial Institutions) (RA000642)
Verified as: H023449
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

REST: https://lei.online/v1/entities/549300C7ONL0PXZY6Y15This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.