Fulton Technologies, Inc.

549300AXT8LBOQANF655

The entity

Country: United States
Legal address: C/O Illinois Corporation Service Co, 801 Adlai Stevenson Drive62703 SpringfieldUnited States (US-IL)
Head office: 5711 Research Dr48188 CantonUnited States (US-MI)

LEI: 549300AXT8LBOQANF655
Registered: December 15, 2014 at 10:36 AM UTC
Last updated: August 4, 2023 at 04:12 PM UTC
Next renewal: September 22, 2018 at 08:07 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Services (Office of the Secretary of State) (RA000608)
Identifier: 55860335
Verified against: Business Services (Office of the Secretary of State) (RA000608)
Verified as: 55860335
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

REST: https://lei.online/v1/entities/549300AXT8LBOQANF655This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.