C-Bond Systems, Inc.

549300AT4ZNI58HTDQ54

The entity

LEI: 549300AT4ZNI58HTDQ54
Registered: July 19, 2018 at 02:31 PM UTC
Last updated: August 22, 2025 at 11:30 PM UTC
Next renewal: August 23, 2025 at 08:42 AM UTC
Issuer: WM Datenservice (5299000J2N45DDNE4Y28)
Registered with: Business Division of the Secretary of State’s office (RA000599)
Identifier: 20071521438
Verified against: Business Division of the Secretary of State’s office (RA000599)
Verified as: 20071521438
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

REST: https://lei.online/v1/entities/549300AT4ZNI58HTDQ54This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.