SERVICE PAYMENT PLAN, INC.

5493007RS232PYZ1C534

The entity

Country: United States
Legal address: C/O ADAM J GRAIS, 30 N LASALLE ST STE 300060602 CHICAGOUnited States (US-IL)
Head office: 303 East Wacker Drive, Suite 23060601 ChicagoUnited States (US-IL)

LEI: 5493007RS232PYZ1C534
Registered: April 8, 2013 at 09:00 AM UTC
Last updated: August 4, 2023 at 03:57 PM UTC
Next renewal: August 28, 2020 at 02:30 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Services (Office of the Secretary of State) (RA000608)
Identifier: 53115829
Verified against: Business Services (Office of the Secretary of State) (RA000608)
Verified as: 53115829
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

REST: https://lei.online/v1/entities/5493007RS232PYZ1C534This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.