RESIDEO TECHNOLOGIES, INC.

5493006TKFPYISY2DS54

The entity

Status: Active
LEI status: Lapsed - not renewed
Category: Company
Legal form: Corporation (XTIQ)
Jurisdiction: US-DE
Entity created: April 24, 2018

Address

Country: United States
Legal address: C/O CORPORATION SERVICE COMPANY, 251 LITTLE FALLS DRIVE19808 WILMINGTONUnited States (US-DE)
Head office: 115 Tabor Road07950 Morris PlainsUnited States (US-NJ)

Identifier

LEI: 5493006TKFPYISY2DS54
Registered: September 20, 2018 at 02:31 PM UTC
Last updated: June 19, 2026 at 06:10 PM UTC
Next renewal: August 5, 2022 at 06:43 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Division of Corporations, Department of State (RA000602)
Identifier: 6857708
Verified against: Division of Corporations, Department of State (RA000602)
Verified as: 6857708
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Owns3

RESIDEO FUNDING INC.
Held through a subsidiaryUnited States
Resideo LLC
Held through a subsidiaryUnited States
RESIDEO SMART HOME TECHNOLOGIES (INDIA) PRIVATE LIMITED
Direct subsidiaryIndia

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

Machine access

REST: https://lei.online/v1/entities/5493006TKFPYISY2DS54This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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