Hi-Tech Mold & Tool, Inc.

54930044BUVH0FE71604

The entity

Country: United States
Legal address: C/O Daniel Kolb, 1 Technology Drive West01201 PittsfieldUnited States (US-MA)
Head office: 1 Technology Drive West01201 PittsfieldUnited States (US-MA)

LEI: 54930044BUVH0FE71604
Registered: June 3, 2013 at 03:56 PM UTC
Last updated: August 4, 2023 at 03:46 PM UTC
Next renewal: January 2, 2018 at 12:20 PM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Corporations Division (Secretary of the Commonwealth's Office) (RA000613)
Identifier: 042798774
Verified against: Corporations Division (Secretary of the Commonwealth's Office) (RA000613)
Verified as: 042798774
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

REST: https://lei.online/v1/entities/54930044BUVH0FE71604This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.