Mold-Tech Singapore Pte Ltd

5493002Q8YOZ2CYWHY96

The entity

Status: Active
LEI status: Lapsed - not renewed
Category: Company
Legal form: 8888
Jurisdiction: Singapore

Address

Country: Singapore
Legal address: KA Place, 159, Kampong Ampat,#01-01368328 SingaporeSingapore

Identifier

LEI: 5493002Q8YOZ2CYWHY96
Registered: March 18, 2017 at 01:51 AM UTC
Last updated: August 5, 2023 at 07:32 AM UTC
Next renewal: March 16, 2018 at 05:56 PM UTC
Issuer: GS1 (52990034RLKT0WSOAM90)
Registered with: Business Registry (RA000523)
Identifier: 199304132N
Verified against: Business Registry (RA000523)
Verified as: 199304132N
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Machine access

REST: https://lei.online/v1/entities/5493002Q8YOZ2CYWHY96This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

Start a new search