Hyde Park Arms, L.L.C.

5493002PUP7TM6VVAN46

The entity

Country: United States
Legal address: c/o Richard Dubin, 123 North Wacker Drive, Suite 160060606 ChicagoUnited States (US-IL)
Head office: 5316 South Harper Avenue60615 ChicagoUnited States (US-IL)

LEI: 5493002PUP7TM6VVAN46
Registered: November 18, 2016 at 01:58 AM UTC
Last updated: April 21, 2023 at 01:32 PM UTC
Next renewal: April 21, 2023 at 12:30 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Services (Office of the Secretary of State) (RA000608)
Identifier: 00023086
Verified against: Business Services (Office of the Secretary of State) (RA000608)
Verified as: 00023086
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

No direct parent reportedNo ultimate parent reported: The accounts are not published

REST: https://lei.online/v1/entities/5493002PUP7TM6VVAN46This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.