ＮＥＸＴ　ＦＵＮＤＳ　Ｓ＆Ｐ　５００　半導体・半導体製造装置３５％キャップ指数連動型上場投信

3538003O5WZMS9H0UL10

The entity

LEI: 3538003O5WZMS9H0UL10
Registered: March 24, 2025 at 12:00 AM UTC
Last updated: March 24, 2026 at 12:00 AM UTC
Next renewal: March 24, 2027 at 12:00 AM UTC
Issuer: Japan Exchange Group/ Tokyo Stock Exchange (JPX/TSE) (353800279ADEFGKNTV65)
Registered with: Register of funds (RA000413)
Identifier: T080534601
Verified against: Register of funds (RA000413)
Verified as: T080534601
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

No direct parent reportedNo ultimate parent reported: No owner is known to control it

REST: https://lei.online/v1/entities/3538003O5WZMS9H0UL10This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.