ハイ・イールドボンドオープン　Ａコース（野村ＳＭＡ向け）

353800156BCEFMNSTU06

The entity

LEI: 353800156BCEFMNSTU06
Registered: August 20, 2014 at 06:00 AM UTC
Last updated: August 20, 2026 at 12:00 AM UTC
Next renewal: August 20, 2027 at 06:00 AM UTC
Issuer: Japan Exchange Group/ Tokyo Stock Exchange (JPX/TSE) (353800279ADEFGKNTV65)
Registered with: Register of funds (RA000413)
Identifier: T080140353
Verified against: Register of funds (RA000413)
Verified as: T080140353
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

No direct parent reportedNo ultimate parent reported: No owner is known to control it

REST: https://lei.online/v1/entities/353800156BCEFMNSTU06This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.