CRPL BUILDCON PRIVATE LIMITED

335800WOU8TDUGVFMI70

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (YSP9)
Jurisdiction: India
Entity created: January 21, 2018

Address

Country: India
Legal address: B-002 GOKUL REGENCY-II THAKUR COMPLEX KANDIVALI-EAST400101 MUMBAI CITYIndia (IN-MH)
Head office: B-002 GOKUL REGENCY-II THAKUR COMPLEX KANDIVALI-EAST400101 MUMBAIIndia (IN-MH)

Identifier

LEI: 335800WOU8TDUGVFMI70
Registered: September 3, 2026 at 01:39 PM UTC
Last updated: September 3, 2026 at 01:39 PM UTC
Next renewal: September 2, 2027 at 06:30 PM UTC
Issuer: LEIL (335800FVH4MOKZS9VH40)
Registered with: Companies Register (RA000394)
Identifier: U45209MH2018PTC304551
Verified against: Companies Register (RA000394)
Verified as: U45209MH2018PTC304551
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/335800WOU8TDUGVFMI70This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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