EMBASSY BUILDCON LLP

335800WMWKEYRZBSQS25

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Liability Partnership (U5S6)
Jurisdiction: India
Entity created: April 21, 2016

Address

Country: India
Legal address: I FLOOR, EMBASSY POINT,560001 BANGALOREIndia

Identifier

LEI: 335800WMWKEYRZBSQS25
Registered: May 17, 2024 at 09:47 AM UTC
Last updated: June 11, 2026 at 10:46 AM UTC
Next renewal: June 11, 2027 at 10:46 AM UTC
Issuer: EQS (529900F6BNUR3RJ2WH29)
Registered with: Companies Register (RA000394)
Identifier: AAG-2031
Verified against: Companies Register (RA000394)
Verified as: AAG-2031
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/335800WMWKEYRZBSQS25This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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