SEKISUI DLJM MOLDING PRIVATE LIMITED

335800OKF2HNK1R15P34

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (YSP9)
Jurisdiction: India
Entity created: May 9, 2011

Address

Country: India
Legal address: 2662, 1ST FLOOR, SADAR THANA ROAD, SADAR BAZAAR110006 DELHIIndia (IN-DL)

Identifier

LEI: 335800OKF2HNK1R15P34
Registered: January 5, 2018 at 01:08 PM UTC
Last updated: December 2, 2025 at 10:38 AM UTC
Next renewal: January 9, 2027 at 06:30 PM UTC
Issuer: LEIL (335800FVH4MOKZS9VH40)
Registered with: Companies Register (RA000394)
Identifier: U25200DL2011PTC218912
Verified against: Companies Register (RA000394)
Verified as: U25200DL2011PTC218912
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Owned by

積水化学工業株式会社
Direct parent · Ultimate parentJapan529900KQIVT7NWFNMI70

Machine access

REST: https://lei.online/v1/entities/335800OKF2HNK1R15P34This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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