HLP INFRATECH LLP

335800G5JUQPL2ZANA51

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Liability Partnership (U5S6)
Jurisdiction: India
Entity created: June 15, 2021

Address

Country: India
Legal address: H.NO. 1203, SECOND FLOOR SECTOR 19B160019 CHANDIGARHIndia (IN-CH)

Identifier

LEI: 335800G5JUQPL2ZANA51
Registered: February 29, 2024 at 12:32 PM UTC
Last updated: January 6, 2026 at 06:16 AM UTC
Next renewal: February 27, 2027 at 06:30 PM UTC
Issuer: LEIL (335800FVH4MOKZS9VH40)
Registered with: Companies Register (RA000394)
Identifier: AAX-4265
Verified against: Companies Register (RA000394)
Verified as: AAX-4265
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/335800G5JUQPL2ZANA51This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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