3D TECHNOPACK PRIVATE LIMITED

3358006M9UGX1DVTQK06

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (YSP9)
Jurisdiction: India
Entity created: September 4, 1986

Address

Country: India
Legal address: 809, 8TH FLOOR, LODHA SUPREMUS, I THINK TECHNO CAMPUS, SUPREMUS III, KANJURMARG (EAST),, MUMBAI CITY400042 MUMBAIIndia (IN-MH)

Identifier

LEI: 3358006M9UGX1DVTQK06
Registered: April 3, 2019 at 04:34 AM UTC
Last updated: March 20, 2026 at 10:10 AM UTC
Next renewal: April 8, 2027 at 06:30 PM UTC
Issuer: LEIL (335800FVH4MOKZS9VH40)
Registered with: Companies Register (RA000394)
Identifier: U29100MH1986PTC040844
Verified against: Companies Register (RA000394)
Verified as: U29100MH1986PTC040844
Corroboration: Confirmed against a public register
GLEIF conformity: Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The accounts are not published

Machine access

REST: https://lei.online/v1/entities/3358006M9UGX1DVTQK06This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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