MOLDCOM, s. r. o.

315700DGRASC3S4T0054

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Společnost s ručením omezeným (9HLU)
Jurisdiction: Czechia
Entity created: September 17, 2007

Address

Country: Czechia
Legal address: Dukelská 547562 01 Ústí nad OrlicíCzechia (CZ-53)

Identifier

LEI: 315700DGRASC3S4T0054
Registered: April 17, 2024 at 11:00 PM UTC
Last updated: March 26, 2026 at 11:37 AM UTC
Next renewal: April 21, 2027 at 11:00 PM UTC
Issuer: CSD Prague (315700LK78Z7C0WMIL03)
Registered with: Commercial Register (RA000163)
Identifier: 27522555
Verified against: Commercial Register (RA000163)
Verified as: 27522555
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

Machine access

REST: https://lei.online/v1/entities/315700DGRASC3S4T0054This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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