大连高新园区易融汇科技小额贷款股份有限公司

300300Z1828321000007

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China

Address

Country
China
Legal address
辽宁省大连市高新园区黄浦路527号海大科技园2号楼B座科技金融大厦24层2403-2405115001 大连市China (CN-LN)

Identifier

LEI
300300Z1828321000007
Registered
Last updated
Next renewal
Identifier
91210200MA0TQJQ538
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91210200MA0TQJQ538
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

Start a new search