大连高新园区国丰科技小额贷款有限责任公司

300300Z1745521000048

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China

Address

Country
China
Legal address
大连高新园区黄浦路596号阳光数码大厦10层11号116023 大连市China (CN-LN)

Identifier

LEI
300300Z1745521000048
Registered
Last updated
Next renewal
Identifier
9121020039634436XX
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
9121020039634436XX
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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