大连高新园区后英科技小额贷款有限公司

300300Z1742421000037

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China

Address

Country
China
Legal address
辽宁省大连市高新技术产业园区黄埔路541号19层1902-1室116023 大连市China (CN-LN)

Identifier

LEI
300300Z1742421000037
Registered
Last updated
Next renewal
Identifier
91210200098871719A
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91210200098871719A
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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