上海虹口东华美钻小额贷款股份有限公司

300300Z1667531000005

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China

Address

Country
China
Legal address
上海市虹口区四川北路848、850号5楼200080 虹口区China (CN-SH)

Identifier

LEI
300300Z1667531000005
Registered
Last updated
Next renewal
Identifier
91310000067783791D
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91310000067783791D
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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