天津世承小额贷款有限公司

300300Z1467912000010

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China
Entity created
November 15, 2010

Address

Country
China
Legal address
津南区八里台镇工业园区100000 津南区China (CN-TJ)

Identifier

LEI
300300Z1467912000010
Registered
Last updated
Next renewal
Identifier
91120000562690285C
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91120000562690285C
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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