大连高新技术产业园区国融小额贷款股份有限公司

300300Z1020421000044

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China

Address

Country
China
Legal address
大连高新园区火炬路3号纳米大厦2楼201室116024 大连市China (CN-LN)

Identifier

LEI
300300Z1020421000044
Registered
Last updated
Next renewal
Identifier
91210200696012949L
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91210200696012949L
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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