天臣国际医疗科技股份有限公司

300300OELXQ5COBRMA79

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China

Address

Country
China
Legal address
苏州工业园区东平街278号215000 苏州市China (CN-JS)

Identifier

LEI
300300OELXQ5COBRMA79
Registered
Last updated
Next renewal
Identifier
91320594761502929D
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91320594761502929D
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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