北京金匙基因科技有限公司

3003009CAPGZL0IWNE79

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China

Address

Country
China
Legal address
北京市昌平区回龙观镇生命园路29号1幢A202室(昌平示范园)100000 昌平区China (CN-BJ)

Identifier

LEI
3003009CAPGZL0IWNE79
Registered
Last updated
Next renewal
Identifier
91110108MA0177EG55
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91110108MA0177EG55
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

Start a new search