天津金匙医学科技有限公司

3003008NVI6TNY4TXW76

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China

Address

Country
China
Legal address
天津市武清开发区福源道北侧创业总部基地B21号楼901室300000 武清区China (CN-TJ)

Identifier

LEI
3003008NVI6TNY4TXW76
Registered
Last updated
Next renewal
Identifier
91120222MA06AJBX93
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91120222MA06AJBX93
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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