四川和邦生物科技股份有限公司

30030072W72E4N589G74

The entity

Status
Active
LEI status
Lapsed - not renewed
Category
Company
Legal form
企业 (ECAK)
Jurisdiction
China
Entity created
August 1, 2002

Address

Country
China
Legal address
乐山市五通桥区牛华镇沔坝村100000 乐山市China (CN-SC)

Identifier

LEI
30030072W72E4N589G74
Registered
Last updated
Next renewal
Identifier
91511100740039656L
Verified against
National Enterprise Credit Information Publicity System (RA000092)
Verified as
91511100740039656L
Corroboration
Confirmed against a public register
GLEIF conformity
Does not meet the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported
No parent prepares consolidated accounts including it

Machine access

MCP
https://lei.online/mcpThe same data as an MCP tool.

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