VegaShares AI Advanced Chip Packaging ETF

254900XS0Q1L2724LI97

The entity

Status: Active
LEI status: Issued and current
Category: Fund
Legal form: 8888
Jurisdiction: United States
Entity created: June 12, 2026

Address

Country: United States
Legal address: C/O The Corporation Trust Company, Corporation Trust Center, 1209 Orange St19801 WilmingtonUnited States (US-DE)
Head office: C/O Tidal Investments LLC, 234 West Florida Street, Suite 70053204 MilwaukeeUnited States (US-WI)

Identifier

LEI: 254900XS0Q1L2724LI97
Registered: August 5, 2026 at 08:43 AM UTC
Last updated: August 5, 2026 at 08:43 AM UTC
Next renewal: August 5, 2027 at 08:43 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: EDGAR (RA000665)
Identifier: S000108199
Verified against: EDGAR (RA000665)
Verified as: S000108199
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Owned by

TIDAL INVESTMENTS LLC
Fund managerUnited States254900SIR1F8HDIXDL70
TIDAL TRUST IV
Umbrella fundUnited States2549002AJTPTPGECMC44

Why no parent is reported

No direct parent reportedNo ultimate parent reported: No parent prepares consolidated accounts including it

Machine access

REST: https://lei.online/v1/entities/254900XS0Q1L2724LI97This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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