BESI APAC SDN. BHD.

254900XICAWX1XRS8495

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Private Limited Company (XEOV)
Jurisdiction: Malaysia
Entity created: October 31, 1990

Address

Country: Malaysia
Legal address: SUITE 16-03, LEVEL 16, WISMA UOA II, NO. 21 JALAN PINANG50450 KUALA LUMPURMalaysia (MY-10)
Head office: RATIO 66921 RW DUIVENNetherlands (NL-GE)

Identifier

LEI: 254900XICAWX1XRS8495
Registered: December 5, 2025 at 09:08 AM UTC
Last updated: December 5, 2025 at 09:08 AM UTC
Next renewal: December 5, 2026 at 09:08 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Corporate Registry (RA000439)
Identifier: 199001015311 (206981-D)
Verified against: Corporate Registry (RA000439)
Verified as: 199001015311 (206981-D)
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Owned by

BE Semiconductor Industries N.V.
Direct parent · Ultimate parentNetherlands7245007A1YFLI2GNYX06

Machine access

REST: https://lei.online/v1/entities/254900XICAWX1XRS8495This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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