INFRASTRUCTURE YIELD PLUS II (USD) LP

254900VRCB4HD725A957

The entity

Status: Active
LEI status: Issued and current
Category: Company
Legal form: Limited Partnership (17FJ)
Jurisdiction: Singapore
Entity created: April 15, 2022

Address

Country: Singapore
Legal address: 9 Raffles Place, #26-01, Republic Plaza048619 SingaporeSingapore
Head office: 9 Raffles Place, #26-01 , Republic Plaza048619 SingaporeSingapore

Identifier

LEI: 254900VRCB4HD725A957
Registered: April 15, 2024 at 09:21 AM UTC
Last updated: March 18, 2026 at 04:43 PM UTC
Next renewal: April 15, 2027 at 09:21 AM UTC
Issuer: Bloomberg (5493001KJTIIGC8Y1R12)
Registered with: Business Registry (RA000523)
Identifier: T21LP0153H
Verified against: Business Registry (RA000523)
Verified as: T21LP0153H
Corroboration: Confirmed against a public register
GLEIF conformity: Meets the standard

Corporate structure

Why no parent is reported

No direct parent reportedNo ultimate parent reported: The parent is one or more private individuals

Machine access

REST: https://lei.online/v1/entities/254900VRCB4HD725A957This record as JSON.
MCP: https://lei.online/mcpThe same data as an MCP tool.

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